Expected Applications

The ThruChip Interface can be used in various applications that need low cost, low power 3D chip stacking.

Examples include:

- Stacked FLASH memory (See ISSCC 2010 paper "A 2 Gb/s 1.8pJ/b Inductive-Coupling ThruChip Bus for 128-Die NAND-Flash Memory Stacking.")

- Stacked DRAM

- Stacked FPGA

- Attaching memory on top of SoC

- Connecting through Image Sensor die

- Non-contact memory card

- Non-contact wafer level testing for known good die

- Silicon interposer